Journals / CMC / Vol.6, No.1
Table of Content


    Characteristic of Waves in A Multi-Walled Carbon Nanotube

    G. Q. Xie1,2,3, X. Han2, S. Y. Long3
    CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 1-12, 2007, DOI:10.3970/cmc.2007.006.001
    Abstract A multi-walled carbon nanotube is modeled as a multiple-elastic cylindrical structure. The numerical-analytical method is adopted to analyze the characteristics of harmonic waves propagating along an anisotropic carbon nanotube. Each wall of the carbon nanotube is divided into three-nodal-line layer elements. The deflections of two adjacent tubes are coupled through the van der Waals. The governing equation of element is obtained from Hamilton's principle. A set of system equation of dynamics equilibrium for the entire structure is obtained by the assembling of all the elements. From solution of the eigenvalue equations, the dispersive characteristics, group velocities of multi-walled carbon nanotubes… More >


    Prediction of Springback in Straight Flanging using Finite Element Method

    S. K. Panthi1,2, N. Ramakrishnan2, K. K. Pathak2, J. S. Chouhan3
    CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 13-20, 2007, DOI:10.3970/cmc.2007.006.013
    Abstract One of the important features of flanging process is elastic recovery during unloading leading to springback. The elastic recovery is associated with various tool and material parameters. It is difficult to analytically predict the elastic recovery accurately owing to the complex material deformation behavior. In this investigation, a commercially available Finite Element software is used for elasto-plastic analysis of flanging process. The springback is studied varying geometrical, material and friction parameters. The results of the simulation are validated with a few published experimental results. More >


    Cyclic Softening Modeling with the Distribution of Non Linear Relaxation (Dnlr) Approach

    L. Dieng1, A. Abdul-Latif2, M. Haboussi, C. Cunat3
    CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 21-34, 2007, DOI:10.3970/cmc.2007.006.021
    Abstract Being of particular interest in this work, a complicated phenomenon related to cyclic softening of metallic polycrystals is modeled. As in the Waspaloy, this phenomenon can take place when a non-proportional tension-torsion cyclic loading of 90° out-of-phase is followed, after cyclic steady state, by a uniaxial one (tension-compression) with the same maximum equivalent plastic strain. By using the DNLR (Distribution of Non Linear Relaxation) model recently proposed by the authors describing the cyclic plasticity of metals, a new extension is here developed. It is recognized that such an extension can satisfactorily reproduce this softening phenomenon. It is noteworthy that this… More >


    Robust Reduction Method for Biomolecules Modeling

    Kilho Eom1, Jeong-Hee Ahn2, Seung-Chul Baek2, Jae-In Kim2, Sungsoo Na2,3
    CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 35-42, 2007, DOI:10.3970/cmc.2007.006.035
    Abstract This paper concerns the application and demonstration of robust reduction methodology for biomolecular structure modeling, which is able to estimate dynamics of large proteins. The understanding of large protein dynamics is germane to gain insight into biological functions related to conformation change that is well described by normal modes. In general, proteins exhibit the complicated potential field and the large degrees of freedom, resulting in the computational prohibition for large protein dynamics. In this article, large protein dynamics is investigated with modeling reduction schemes. The performance of hierarchical condensation methods implemented in the paper is compared with that obtained from… More >


    Evaluations of the BGA Solder Ball Shape by Using Energy Method

    Heng Cheng Lin1,2, Chieh Kung3, Rong Sheng Chen2
    CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 43-50, 2007, DOI:10.3970/cmc.2007.006.043
    Abstract Presented herein are the evaluation results of the BGA solder ball shape using energy method, two types of solder, viz. Sn37Pb and Sn80Pb, are selected .The geometry of the solder bump is firstly estimated using free computer software, the Surface Evolver, an interactive program which is an energy-based approach for the study of liquid droplet surfaces shaped by surface tension and other energies. The solder bump is then numerically constructed in a finite element model that simulates a BGA package. The influences of both upper and bottom solder pad radii, the surface tension on the balls, and the external load… More >

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