Journals / CMC / Vol.36, No.3
Table of Content


    Effect of the Strain Rate and Microstructure on Damage Growth in Aluminum

    R. R. Valisetty1, A.M. Dongare2, A.M. Rajendran3, R. R. Namburu1
    CMC-Computers, Materials & Continua, Vol.36, No.3, pp. 231-255, 2013, DOI:10.3970/cmc.2013.036.231
    Abstract Materials used in soldier protective structures, such as armor, vehicles and civil infrastructures, are being improved for performance in extreme dynamic environments. Nanocrystalline metals show significant promise in the design of these structures with superior strengths attributed to the dislocation-based and grain-boundary-based processes as compared to their polycrystalline counterparts. An optimization of these materials, however, requires a fundamental understanding of damage evolution at the atomic level. Accordingly, atomistic molecular dynamics simulations are performed using an embedded-atom method (EAM) potential on three nano-crystalline aluminum atom systems, one a Voronoi-based nano-crystalline system with an average grain size of 10 nm, and the… More >


    Numerical Evaluation of Variation in ‘Characteristic Distance’ due to Fracture Specimen Thickness and Temperature

    Sanjeev Saxena1, Raghvendra Singh2, Geeta Agnihotri2
    CMC-Computers, Materials & Continua, Vol.36, No.3, pp. 257-270, 2013, DOI:10.3970/cmc.2013.036.257
    Abstract The present numerical study is an attempt to understand the dependency of characteristic distance on the fracture specimen thickness and temperature. The presented work will be useful to establish the characteristic distance prediction methodology using three dimensional FEM model. Based on the methods proposed for the numerical prediction of characteristic distance, it comes out that it depends on fracture specimen thickness and finally it converges after a specified thickness of fracture specimen. In Armco iron material, characteristic distance varies in temperature ranges where dynamic strain ageing phenomenon is observed, initially decrease and then increases again. More >


    Theoretical Modeling of the Radiative Properties and Effective Thermal Conductivity of the Opacified Silica Aerogel

    Zichun Yang1,2,3, Gaohui Su1,4, Fengrui Sun1
    CMC-Computers, Materials & Continua, Vol.36, No.3, pp. 271-292, 2013, DOI:10.3970/cmc.2013.036.271
    Abstract In this paper, we investigate the radiative properties and the effective thermal conductivity (ETC) of the opacified silica aerogel by theoretical method. The radiative properties of the opacified silica aerogel are obtained by the modified Mie Scattering Theory that is used for particle scattering in absorbing medium. The modified gamma distribution is used to take account of the non-uniformity of the particle size. The solid thermal conductivity of the composite material is obtained by considering the scale effect of the particles. Based on these calculated thermophysical properties the coupled heat conduction and radiation through the evacuated opacified aerogel are solved… More >


    A Cell Method Stress Analysis in Thin Floor Tiles Subjected to Temperature Variation

    E. Ferretti1
    CMC-Computers, Materials & Continua, Vol.36, No.3, pp. 293-322, 2013, DOI:10.3970/cmc.2013.036.293
    Abstract The Cell Method is applied in order to model the debonding mechanism in ceramic floor tiles subjected to positive thermal variation. The causes of thermal debonding, very usual in radiant heat floors, have not been fully clarified at the moment. There exist only a few simplified analytical approaches that assimilate this problem to an eccentric tile compression, but these approaches introduce axial forces that, in reality, do not exist. In our work we have abandoned the simplified closed form solution in favor of a numerical solution, which models the interaction between tiles and sub-base more realistically, when the positive thermal… More >

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