Journals / CMC / Vol.36, No.2
Table of Content


    Estimation of the Mechanical Property of CNT Ropes Using Atomistic-Continuum Mechanics and the Equivalent Methods

    C.J. Huang1, T.Y. Hung1, K.N. Chiang2
    CMC-Computers, Materials & Continua, Vol.36, No.2, pp. 99-133, 2013, DOI:10.3970/cmc.2013.036.099
    Abstract The development in the field of nanotechnology has prompted numerous researchers to develop various simulation methods for determining the material properties of nanoscale structures. However, these methods are restricted by the speed limitation of the central processing unit (CPU), which cannot estimate larger-scale nanoscale models within an acceptable time. Thus, decreasing the CPU processing time and retaining the estimation accuracy of physical properties of nanoscale structures have become critical issues. Accordingly, this study aims to decrease the CPU processing time and complexity of large nanoscale models by utilizing, atomistic-continuum mechanics (ACM) to build an equivalent model of carbon nanotubes (CNTs).… More >


    Correspondence Relations for Fracture Parameters of Interface Corners in Anisotropic Viscoelastic Materials

    Chyanbin Hwu1, Tai-Liang Kuo2
    CMC-Computers, Materials & Continua, Vol.36, No.2, pp. 135-153, 2013, DOI:10.3970/cmc.2013.036.135
    Abstract The problems of the interface corners between two dissimilar anisotropic viscoelastic materials are studied in this paper. Through the use of the well-known correspondence principle between linear elasticity and linear viscoelasticity, fracture parameters in the Laplace domain can be obtained from the path-independent H-integral for the corresponding problems of anisotropic linear elastic materials. Further application of the correspondence relations for fracture parameters proposed in our recent study then leads us the solutions of fracture parameters in the time domain. To show the applicability and accuracy of the proposed method, several different kinds of numerical examples are presented such as a… More >


    Thermal-Cyclic Fatigue Life Analysis and Reliability Estimation of a FCCSP based on Probabilistic Design Concept

    Yao Hsu1, Chih-Yen Su2, Wen-Fang Wu3,4
    CMC-Computers, Materials & Continua, Vol.36, No.2, pp. 155-176, 2013, DOI:10.3970/cmc.2013.036.155
    Abstract To study the fatigue reliability of a flip-chip chip scale package (FCCSP) subject to thermal cyclic loading, a Monte Carlo simulation-based parametric study is carried out in the present study. A refined procedure as compared with the recently released Probabilistic Design System (PDS) of ANSYS is proposed and employed in particular. The thermal-cyclic fatigue life of the package is discussed in detail since it is related directly to the reliability of the package. In consideration of the analytical procedure as well as real manufacturing processes, a few geometric dimensions and material properties of the package are assumed random. The empirical… More >


    Heat Conduction Analysis of Nonhomogeneous Functionally Graded Three-Layer Media

    Chien-Ching Ma1,2, Yi-Tzu Chen2
    CMC-Computers, Materials & Continua, Vol.36, No.2, pp. 177-201, 2013, DOI:10.3970/cmc.2013.036.177
    Abstract Functionally graded material (FGM) is a particulate composite with continuously changing its thermal and mechanical properties in order to raise the bonding strength in the discrete composite made from different phases of material constituents. Furthermore, FGM is a potent tool to create an intermediate layer in metal–ceramic composites to avoid the properties discontinuities and reduce, thereby, the residual stresses. For the nonhomogeneous problem, the mathematical derivation is much complicated than the homogeneous case since the material properties vary with coordinate. To analyze the problem, the Fourier transform is applied and the general solution in transform domain is obtained. The inverse… More >


    Thermal-Mechanical and Thermodynamic Properties of Graphene Sheets using a Modified Nosé-Hoover Thermostat

    Ching-Feng Yu1, Wen-Hwa Chen1,2, Kun-Ling Chen1, Hsien-Chie Cheng2,3
    CMC-Computers, Materials & Continua, Vol.36, No.2, pp. 203-229, 2013, DOI:10.3970/cmc.2013.036.203
    Abstract The investigation assesses the thermal-mechanical and thermodynamic properties of various graphene sheets using a modified Nosé-Hoover (NH) thermostat method incorporated with molecular dynamics (MD) simulation. The investigation begins with an exploration of their thermal-mechanical properties at atmospheric pressure, including Young’s modulus, shear modulus, Poisson’s ratio, specific heats and linear and volumetric coefficients of thermal expansion (CTE). Two definitions of the line change ratio (ΔL/L) are utilized to determine the linear CTE of graphene sheets, and the calculations are compared with each other and data in the literature. To estimate the volumetric CTE values, the Connolly surface method is applied to… More >

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