Journals / CMC / Vol.20, No.1
Table of Content


    Indentation Load-Displacement Relations for the Spherical Indentation of Elastic Film/Substrate Structures

    S. N.V.R.K. Kurapati1, Y. C. Lu1, F. Yang2
    CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 1-18, 2010, DOI:10.3970/cmc.2010.020.001
    Abstract The spherical indentation of elastic film /substrate structures is analyzed using the finite element method. The load-displacement curves of the film /substrate structures of various configurations are obtained and analyzed. A generalized power law relation is established, which can be used to analyze the load-displacement curve of elastic film /substrate systems under spherical indentations. The indentation load is dependent on the modulus ratio of the film to the substrate and film thickness. A semi-analytical expression for the power of the power law relation is also obtained as a function of the normalized film thickness and normalized film modulus, which can… More >


    Numerical Formulations for the Prediction of Deformation, Strain and Stress of Un-patterned ETFE Cushions

    N.J. Bartle1, P.D. Gosling1
    CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 19-62, 2010, DOI:10.3970/cmc.2010.020.019
    Abstract ETFE cushions are increasingly being used to form high-profile facades and structural forms. This investigation aims to extend an analytical theory of large deformation in order to predict the shape and stress distributions of an un-patterned square ETFE cushion without the need to resort to discretised numerical methods. In order to assess the validity of the theoretical procedure a prototype cushion has been analysed using a finite element simulation. The theoretical procedure is also compared with alternative approximate equations proposed for the design of ETFE cushions. More >


    On the Contact Characteristics between Droplet and Microchip/Binding Site for Self-Alignment

    Wen-Hwa Chen1,2, Tsung-Yu Huang1
    CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 63-84, 2010, DOI:10.3970/cmc.2010.020.063
    Abstract The contact characteristics between a droplet and a microchip/binding site strongly affect the accuracy of self-alignment in the self-assembly of micro-electronic-mechanical systems. This study is mainly to implement the Surface Evolver Program, which is commonly adopted for studying surface shaped by surface tension and other energies, to investigate comprehensively the contact characteristics between the small droplet and the microchip/binding site. The details of changes in the contact line and the contact area when the microchip is subjected to translation, compression, yawing and rolling are drawn. The three-dimensional deformation of the droplet between the microchip and the binding site is also… More >


    Design of a Two-State Shuttle Memory Device

    Richard K. F. Lee1, James M. Hill2
    CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 85-100, 2010, DOI:10.3970/cmc.2010.020.085
    Abstract In this study, we investigate the mechanics of a metallofullerene shuttle memory device, comprising a metallofullerene which is located inside a closed carbon nanotube. The interaction energy for the system is obtained from the 6-12 Lennard-Jones potential using the continuum approximation, which assumes that a discrete atomic structure can be replaced by an average atomic surface density. This approach shows that the system has two equal minimum energy positions, which are symmetrically located close to the tube extremities, and therefore it gives rise to the possibility of being used as a two-state memory device. On one side the encapsulated metallofullerene… More >

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