Journals / CMC / Vol.16, No.3
Table of Content


    Numerical and Experimental Analysis of Welding Deformation in Thin Plates

    M.R. Khoshravan1 and M.A. Setoodeh1
    CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 195-228, 2010, DOI:10.3970/cmc.2010.016.195
    Abstract The use of welding to permanently join plates is common in industry due to its high efficiency. But welding creates thermal stresses, which can lead to residual stresses and physical distortion. This phenomenon directly influences the buckling stiffness of the welded structure. The welding distortion not only makes difficult the erection of the project, but also influences the final quality and cost of production. In this research, the thermo-elastic-plastic conditions were simulated by a three-dimensional (3D) finite element model (FE). Mechanical and thermal properties of the material were applied to the model, leading to eigenvalue analysis of the thermal and… More >


    Interface Effect on the Dynamic Stress around an Elliptical Nano-Inhomogeneity Subjected to Anti-Plane Shear Waves

    Xue-Qian Fang1,2, Xiao-Hua Wang1, Le-Le Zhang3
    CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 229-246, 2010, DOI:10.3970/cmc.2010.016.229
    Abstract In the design of advanced micro- and nanosized materials and devices containing inclusions, the effects of surfaces/interfaces on the stress concentration become prominent. In this paper, based on the surface/interface elasticity theory, a two-dimensional problem of an elliptical nano-inhomogeneity under anti-plane shear waves is considered. The conformal mapping method is then applied to solve the formulated boundary value problem. The analytical solutions of displacement fields are expressed by employing wave function expansion method, the expanded mode coefficients are determined by satisfying the boundary conditions at the interfaces of the nano-inhomogeneity. Analyses show that the effect of the interfacial properties on… More >


    Three Dimensional Nanoscale Abrasive Cutting Simulation and Analysis for Single-Crystal Silicon Workpiece

    Zone-Ching Lin1and Ren-Yuan Wang1
    CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 247-272, 2010, DOI:10.3970/cmc.2010.016.247
    Abstract The paper establishes a new three-dimensional quasi-steady molecular statics nanoscale abrasive cutting model to investigate the abrasive cutting behavior in the downpressing and abrasive cutting process of a workpiece in chemical mechanical polishing (CMP) process. The downpressing and abrasive cutting process is a continuous process. The abrasive cutting process is done after the single abrasive particle has downpressed and penetrated a workpiece to a certain depth of a workpiece. The paper analyzes the effects of the abrasive particles with different diameters on action force. It also analyzes the action force change of abrasive particles with different diameters on the projected… More >


    Thermo-Elastic Localization Relationships for Multi-Phase Composites

    Giacomo Landi1, Surya R. Kalidindi2
    CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 273-294, 2010, DOI:10.3970/cmc.2010.016.273
    Abstract In this paper, we present a computationally efficient multi-scale framework for predicting the local fields in the representative volume element of a multiphase material system subjected to thermo-mechanical loading conditions. This framework for localization relationships is a natural extension of our recent work on two-phase composites subjected to purely mechanical loading. In this novel approach, the localization relationships take on a simple structure expressed as a series sum, where each term in the series is a convolution product of local structure and the governing physics expressed in the form of influence coefficients. Another salient feature of this approach is its… More >

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